2018 American Packaging Summit

The Packaging School Industry Partnership for 2018 American Packaging Summit 

The Packaging School is thrilled to be an official Industry Partner for the 2018 American Packaging Summit on June 6-7 in Chicago, IL.

This summit brings together leaders from across all industry sectors – food and beverage, CPG, cosmetics, pharma, retail, toys and more – involved in the business of packaging. Network with over 150 senior-level packaging executives, connect with exhibitors and learn from the top influencers as we explore strategies to drive innovation, growth and profitability in an ever-evolving market.

Key Speakers Include:
Packaging Innovation That Fulfills Both Product Performance and Customer Needs
— Yolanda Malone, VP, Global R&D Snacks and Foods Packaging

Discussing the Importance of a Major Rebrand to Accommodate New Product-Line Expansions
— Leland Maschmeyer, Chief Creative Officer

How to Achieve Waste-Free Packaging by 2020 Through Innovation and Sustainable Alternatives
— Oliver Campbell, Director, Worldwide Procurement and Packaging Engineering

Featured Attendees:

Alumni and students of The Packaging School are eligible to receive 65% off Delegate Registration ($695 + 13% service fee), and sponsors are eligible to receive special features in sponsorship packages, such as custom publishing and additional social media amplification.

Need more info? Ask us.

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