The Packaging School Industry Partnership for 2018 American Packaging Summit
The Packaging School is thrilled to be an official Industry Partner for the 2018 American Packaging Summit on June 6-7 in Chicago, IL.
This summit brings together leaders from across all industry sectors – food and beverage, CPG, cosmetics, pharma, retail, toys and more – involved in the business of packaging. Network with over 150 senior-level packaging executives, connect with exhibitors and learn from the top influencers as we explore strategies to drive innovation, growth and profitability in an ever-evolving market.
Key Speakers Include:
Packaging Innovation That Fulfills Both Product Performance and Customer Needs
— Yolanda Malone, VP, Global R&D Snacks and Foods Packaging
Discussing the Importance of a Major Rebrand to Accommodate New Product-Line Expansions
— Leland Maschmeyer, Chief Creative Officer
How to Achieve Waste-Free Packaging by 2020 Through Innovation and Sustainable Alternatives
— Oliver Campbell, Director, Worldwide Procurement and Packaging Engineering
Alumni and students of The Packaging School are eligible to receive 65% off Delegate Registration ($695 + 13% service fee), and sponsors are eligible to receive special features in sponsorship packages, such as custom publishing and additional social media amplification.
Need more info? Ask us.